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Semiconductors

Diodes
Diodes

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Bridge Rectifiers

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Discrete Semiconductors Modules

Thyristors
Thyristors

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Triacs

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Diacs

Transistors
Transistors

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Integrated Circuits

Semiconductors - Accessories
Semiconductors - Accessories

Programmers and Erasers
Programmers and Erasers

Development Kits
Development Kits

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Communication Modules

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Embedded Systems

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Dev.kit: TI MSP432; RJ45,USB C,supply; Comp: MSP432P401R

Dev.kit: TI MSP432; RJ45,USB C,supply; Comp: MSP432P401R
» Availability: 2 pcs   » MIKROELEKTRONIKA

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Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 1mm; 6W/mK; UL94V-0

Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 1mm; 6W/mK; UL94V-0
» Availability: 3 pcs   » FISCHER ELEKTRONIK

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Module: IGBT; diode/transistor; buck chopper; Urmax: 1.2kV; Ic: 75A

Module: IGBT; diode/transistor; buck chopper; Urmax: 1.2kV; Ic: 75A
» Availability: 2 pcs   » INFINEON TECHNOLOGIES

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Expansion board; prototype board; SMA x2,SYZYGY

Expansion board; prototype board; SMA x2,SYZYGY
» Availability: 1 pcs   » DIGILENT

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Dev.kit: Microchip AVR; ATMEGA,ATTINY; Components: ATMEGA32-16PU

Dev.kit: Microchip AVR; ATMEGA,ATTINY; Components: ATMEGA32-16PU
» Availability: 1 pcs   » MIKROE

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RFID reader; 9÷30V; RS485,USB; OSDP; Range: 100mm; 160mA; 848kbps

RFID reader; 9÷30V; RS485,USB; OSDP; Range: 100mm; 160mA; 848kbps
» Availability: 1 pcs   » ELATEC

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Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 3mm; 2.5W/mK

Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 3mm; 2.5W/mK
» Availability: 2 pcs   » FISCHER ELEKTRONIK

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