Solder; Sn96,5Ag3Cu0,5; paste; syringe; 8g; 1.4ml; Flux: No Clean
Solder type | for soft soldering |
Alloy composition | Sn96,5Ag3Cu0,5 |
Appearance | paste |
Package type | syringe |
Weight | 8g |
Capacity | 1.4ml |
Flux type | No Clean |
Flux content | 15% |
Applications of soldering equipment | SMD soldering |
Melting point | 217°C |
Grain size | 25...45µm |
Agent properties | lead free , residues need no cleaning , residues can be cleaned with alcohol-based agents |